PROBER AND NEEDLE-TIP POLISHING DEVICE FOR PROBE CARD

A prober 10 including a probe card 16 having multiple probe needles 17 includes a needle-tip polishing unit 24, and the needle-tip polishing unit 24 includes a WAPP 28 to be contacted with needle tips and a supporting member 27 configured to support the WAPP 28. On a top surface of the WAPP 28, a wr...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	YANO KAZUYA, AKIYAMA SHUJI
Format:	Patent
Sprache:	eng
Schlagworte:	DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING MEASURING MEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES PERFORMING OPERATIONS PHYSICS POLISHING TESTING TRANSPORTING
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Beschreibung
Zusammenfassung:	A prober 10 including a probe card 16 having multiple probe needles 17 includes a needle-tip polishing unit 24, and the needle-tip polishing unit 24 includes a WAPP 28 to be contacted with needle tips and a supporting member 27 configured to support the WAPP 28. On a top surface of the WAPP 28, a wrapping sheet 29 is provided, and the WAPP 28 includes multiple recesses 31 formed on a bottom surface 30 thereof and the supporting member 27 includes multiple protrusions 33 formed on a ceiling surface 32 thereof. When the WAPP 28 is moved to a retreat position, the protrusions 33 are respectively inserted and fitted into the recesses 31, and when the WAPP 28 is moved to a contact position, top portions of the protrusions 33 are respectively brought into contact with portions on the bottom surface 30 where the recesses 31 are not formed.