SYSTEMS AND METHODS FOR REDUCING CURRENT AND INCREASING VOLTAGE IN THERMOELECTRIC SYSTEMS

In certain embodiments, a thermoelectric assembly and method is provided that can be configured to be in thermal communication with a generally tubular first fluid conduit configured to allow a first fluid to flow through the first fluid conduit along a first direction. The thermoelectric assembly can extend at least partially around a perimeter of the first fluid conduit. The thermoelectric assembly can include a plurality of thermoelectric sub-assemblies aligned with one another along the perimeter of the first fluid conduit. Each thermoelectric sub-assembly can include a plurality of thermoelectric elements in parallel electrical communication with one another. Each thermoelectric sub-assembly can also include at least one shunt comprising a first portion and a second portion. The first portion can be in thermal communication with and mechanically coupled to the plurality of thermoelectric elements and be in thermal communication with at least one second fluid conduit. The second portion can be in thermal communication with and mechanically coupled to the first portion and have a curved surface in thermal communication with the first fluid conduit. Each thermoelectric sub-assembly can include a plurality of electrically insulating elements to prevent current flow in a plane perpendicular to the first direction between adjacent thermoelectric sub-assemblies.