PLACING INTEGRATED CIRCUIT DEVICES USING PERTURBATION

PLACING INTEGRATED CIRCUIT DEVICES USING PERTURBATION

Placing integrated circuit devices using a perturbation is described. In one example, a testing platform has a circuit board. A socket is on the board for receiving and connecting to an integrated circuit package. The socket has an array of pins to engage connection bumps on a surface of the package...

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Bibliographische Detailangaben
Hauptverfasser: DIGLIO PAUL J, SANCHEZ RENE J, JENSEN MORTEN S, ABAZARNIA NADER N, SCHROEDER CHRISTOPHER R
Format: Patent
Sprache:eng
Schlagworte:
MEASURING
MEASURING ELECTRIC VARIABLES
MEASURING MAGNETIC VARIABLES
PHYSICS
TESTING
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Beschreibung
Zusammenfassung:Placing integrated circuit devices using a perturbation is described. In one example, a testing platform has a circuit board. A socket is on the board for receiving and connecting to an integrated circuit package. The socket has an array of pins to engage connection bumps on a surface of the package and a biasing feature to guide the package into alignment with the pins of the socket. A perturbation source induces movement of the package into alignment with the pins of the socket.