SEMICONDUCTOR WAFER DICING BLADE

A dicing blade suitable for cutting a semiconductor wafer has an edge of fine grit for polishing a top surface of the wafer and a protruding part of coarse grit for making an initial cut into the wafer. The blade reduces chipping of the top surface of the wafer and increases throughput by facilitati...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	FOONG CHEE SENG, YOW KAI YUN, KOH WEN SHI
Format:	Patent
Sprache:	eng
Schlagworte:	GRINDING PERFORMING OPERATIONS POLISHING TOOLS FOR GRINDING, BUFFING, OR SHARPENING TRANSPORTING WORKING CEMENT, CLAY, OR STONE WORKING STONE OR STONE-LIKE MATERIALS
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