SEMICONDUCTOR WAFER DICING BLADE

SEMICONDUCTOR WAFER DICING BLADE

A dicing blade suitable for cutting a semiconductor wafer has an edge of fine grit for polishing a top surface of the wafer and a protruding part of coarse grit for making an initial cut into the wafer. The blade reduces chipping of the top surface of the wafer and increases throughput by facilitati...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: FOONG CHEE SENG, YOW KAI YUN, KOH WEN SHI
Format: Patent
Sprache:eng
Schlagworte:
GRINDING
PERFORMING OPERATIONS
POLISHING
TOOLS FOR GRINDING, BUFFING, OR SHARPENING
TRANSPORTING
WORKING CEMENT, CLAY, OR STONE
WORKING STONE OR STONE-LIKE MATERIALS
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Beschreibung
Zusammenfassung:A dicing blade suitable for cutting a semiconductor wafer has an edge of fine grit for polishing a top surface of the wafer and a protruding part of coarse grit for making an initial cut into the wafer. The blade reduces chipping of the top surface of the wafer and increases throughput by facilitating cutting and polishing in one operation. The blade can dice and polish comparatively thick wafers having narrow scribe lines in a single operation.