ADHESIVE FORMULATIONS
The present invention relates to adhesive formulations based on uretdione-group-comprising polyaddition compounds that are free of isocyanate groups and monomeric polyisocyanates, and to the use thereof for the production of adhesive bonds between substrates, in particular for the production of flex...
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | The present invention relates to adhesive formulations based on uretdione-group-comprising polyaddition compounds that are free of isocyanate groups and monomeric polyisocyanates, and to the use thereof for the production of adhesive bonds between substrates, in particular for the production of flexible film composites. |
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