CLEANING COMPOSITION FOR REMOVING ORGANIC MATERIAL AND METHOD OF FORMING SEMICONDUCTOR DEVICE USING THE COMPOSITION

Provided are a cleaning composition for removing an organic material remaining on an organic layer and a method of forming a semiconductor device using the composition. The cleaning composition includes 0.01-5 wt %.hydroxide based on a total weight of the cleaning composition and deionized water.

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: KANG INGOO, HONG YOUNG TAEK, KANG DONG-MIN, KIM YUN-JEONG, CHOI JUNGSIK, KIM SANGKYUN
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:Provided are a cleaning composition for removing an organic material remaining on an organic layer and a method of forming a semiconductor device using the composition. The cleaning composition includes 0.01-5 wt %.hydroxide based on a total weight of the cleaning composition and deionized water.