ELECTRONIC COMPONENT MOUNTING SYSTEM AND ELECTRONIC COMPONENT MOUNTING METHOD

An electronic component mounting system includes a screen printing apparatus, a coating unit and an electronic component mounting apparatus. The screen printing apparatus supplies a solder paste to a plurality of first lands among lands of a board, using a mask plate including pattern holes formed s...

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Bibliographische Detailangaben
Hauptverfasser:	NAKATSUJI HACHIRO, OKAMOTO KENJI
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	An electronic component mounting system includes a screen printing apparatus, a coating unit and an electronic component mounting apparatus. The screen printing apparatus supplies a solder paste to a plurality of first lands among lands of a board, using a mask plate including pattern holes formed so as to correspond to the plurality of first lands. The coating unit includes a discharge port for discharging the solder paste, and coats the solder paste through the discharge port on a plurality of second lands other than the plurality of first lands on the board to which the solder paste is supplied through the screen printing apparatus. The electronic component mounting apparatus mounts the electronic components on the first and second lands to which the solder paste is supplied through the screen printing apparatus and the coating unit.