CARRIER AND METHOD OF FABRICATING SEMICONDUCTOR DEVICE USING THE SAME

CARRIER AND METHOD OF FABRICATING SEMICONDUCTOR DEVICE USING THE SAME

Provided are a carrier and a method of fabricating a semiconductor device using the same. The carrier may include a recess region provided adjacent to an edge thereof. The recess region may be configured to confine an adhesive layer within a desired region including the recess region. The recess reg...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: PARK BYUNG LYUL, PARK JISOON, JEON HYUNGJUN
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:Provided are a carrier and a method of fabricating a semiconductor device using the same. The carrier may include a recess region provided adjacent to an edge thereof. The recess region may be configured to confine an adhesive layer within a desired region including the recess region. The recess region makes it possible to reduce a process failure in a process of fabricating a semiconductor device.