MEMORY MULTI-CHIP PACKAGE (MCP) WITH INTEGRAL BUS SPLITTER

A device includes multiple memory devices, a bus splitter and a package. The bus splitter is configured to exchange storage commands and data with an external host using an external Input/Output (I/O) bus, and to distribute the storage commands and the data over multiple buses connected to respective subsets of the memory devices, so as to relay the storage commands and the data between the multiple memory devices and the external host. The memory devices and the bus splitter are contained in the package, in a multi-chip package (MCP) structure.