Forced Directional Heat Flow Structures and Methods

This disclosure discusses methods and processes to force directional heat flow from a heat source such as a transistor, group of transistors, integrated circuit, or other heat source to a desirable location while preventing heat flow in other directions. Such directional heat flow can occur through...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	WILKERSON JONATHAN RYAN
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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