Forced Directional Heat Flow Structures and Methods

This disclosure discusses methods and processes to force directional heat flow from a heat source such as a transistor, group of transistors, integrated circuit, or other heat source to a desirable location while preventing heat flow in other directions. Such directional heat flow can occur through the strategic placement of thermal insulator and thermal conductor layers. Both thermal insulator and thermal conductor should be alternating and must have a significant difference in thermal conductivity. Loss of heat from the directional heat guide is controlled by either alternating layers of thermal conductor and insulator, or by increasing the disparity in thermal conductivities between the thermal conductor and insulator, or both.