SOLDER RESIST OPENING STRUCTURE AND CIRCUIT BOARD

A solder resist opening structure that exposes an electrode pad through a solder resist opening. The solder resist opening has a bottom diameter of about 80 μm or less with a first tolerance less than about 2.5 μm, the bottom diameter being smaller than a diameter of the electrode pad; an inverted t...

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Bibliographische Detailangaben
Hauptverfasser: NAM HYO SEUNG, LEE CHANG BO, HONG DAE JO
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:A solder resist opening structure that exposes an electrode pad through a solder resist opening. The solder resist opening has a bottom diameter of about 80 μm or less with a first tolerance less than about 2.5 μm, the bottom diameter being smaller than a diameter of the electrode pad; an inverted trapezoidal cross section with a top diameter larger than the bottom diameter; and a diameter difference between the top diameter and the bottom diameter of about 10 μm or more with a second tolerance less than about 2.5 μm