METHODS FOR FABRICATING INTEGRATED CIRCUITS USING CHEMICAL MECHANICAL POLISHING

Methods for fabricating integrated circuits are disclosed. In an exemplary embodiment, a method for fabricating an integrated circuit includes forming a silicon material layer over a semiconductor substrate. The semiconductor substrate includes a logic device region and a memory array region. The me...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	WU LING, YANG JIAN BO, LIM ALAN CING GIE, LEONG LUP SAN
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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