FOLDABLE PACKAGE STRUCTURE

FOLDABLE PACKAGE STRUCTURE

A foldable package structure including a first substrate, a second substrate, a plurality of adhesive layers and at least one environmental-sensitive electronic component is provided. At least one of the first and second laminated substrates comprises an ultra-thin glass plate. The foldable package...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: LEE CHENGUNG, CHEN KUANG-JUNG
Format: Patent
Sprache:eng
Schlagworte:
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:A foldable package structure including a first substrate, a second substrate, a plurality of adhesive layers and at least one environmental-sensitive electronic component is provided. At least one of the first and second laminated substrates comprises an ultra-thin glass plate. The foldable package structure comprises a predetermined folded region and the ultra-thin glass plate is disposed at one side of the predetermined folded region and stays away from the predetermined folded region.