HEAT SINK DEVICE

A refrigerant inlet header 30 is in communication with a cooling unit 20 in a longitudinal lateral surface 20C of the refrigerant inlet header 30. Cooling fluid is flowed into the cooling unit 20 through the part where the refrigerant inlet header 30 is in communication with the cooling unit 20. A r...

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Bibliographische Detailangaben
Hauptverfasser:	NISHI SHINSUKE, MORI SHOGO, OTOBE YURI
Format:	Patent
Sprache:	eng
Schlagworte:	BLASTING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY HEAT EXCHANGE IN GENERAL HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT HEATING LIGHTING MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MECHANICAL ENGINEERING PRINTED CIRCUITS WEAPONS
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Beschreibung
Zusammenfassung:	A refrigerant inlet header 30 is in communication with a cooling unit 20 in a longitudinal lateral surface 20C of the refrigerant inlet header 30. Cooling fluid is flowed into the cooling unit 20 through the part where the refrigerant inlet header 30 is in communication with the cooling unit 20. A refrigerant outlet header 40 is in communication with the cooling unit 20 in a longitudinal lateral surface 20D of the refrigerant outlet header 40. Cooling fluid is flowed out through the part where the refrigerant outlet header 40 is in communication with the cooling unit 20. In a passage of the cooling unit 20 for cooling fluid, a plurality of pin fins 25 is disposed in a stagger arrangement along the longitudinal direction of the refrigerant inlet and outlet headers 30 and 40.