Positive Photosensitive Resin Composition, Photosensitive Resin Film Prepared by Using the Same, and Display Device

Disclosed are a positive photosensitive resin composition including (A) a polybenzoxazole precursor having a polydispersity of about 1 to about 1.6; (B) a photosensitive diazoquinone compound; (C) a thermal acid generator; and (D) a solvent, a photosensitive resin film using the same, and a display...

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Bibliographische Detailangaben
Hauptverfasser:	KIM SANG-SOO, HWANG INUL, LEE JONG-HWA, BAEK JAE-YEOL, LEE JIN-YOUNG, KANG JIN-HEE, NOH KUN-BAE, KIM DAE-YUN, SONG JAE-HWAN, PARK EUN-BI, HWANG EUN-HA, KWON JI-YUN, HONG CHUNG-BEUM, KIM SANG-KYEON, KIM YONG-TAE, LEE BUM-JIN
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS
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Beschreibung
Zusammenfassung:	Disclosed are a positive photosensitive resin composition including (A) a polybenzoxazole precursor having a polydispersity of about 1 to about 1.6; (B) a photosensitive diazoquinone compound; (C) a thermal acid generator; and (D) a solvent, a photosensitive resin film using the same, and a display device.