THERMALLY AWARE PIN ASSIGNMENT AND DEVICE PLACEMENT

THERMALLY AWARE PIN ASSIGNMENT AND DEVICE PLACEMENT

Embodiments of the disclosure relate to methods for facilitating the design of an integrated circuit (IC) using thermally aware pin assignment and device placement. The method includes creating a layout for the IC, the layout including a plurality of macros each having devices and pin assignments an...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: DARDEN RANDALL J, SAHA SOURAV, RAMJI SHYAM
Format: Patent
Sprache:eng
Schlagworte:
CALCULATING
COMPUTING
COUNTING
ELECTRIC DIGITAL DATA PROCESSING
PHYSICS
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Beschreibung
Zusammenfassung:Embodiments of the disclosure relate to methods for facilitating the design of an integrated circuit (IC) using thermally aware pin assignment and device placement. The method includes creating a layout for the IC, the layout including a plurality of macros each having devices and pin assignments and revising the layout for the IC by repositioning a macro or a device to meet a timing requirement of the IC. The method also includes creating a thermal map of the IC based on the layout for the IC and a workload model for the IC and identifying at least one thermally critical pin assignment based on the thermal map of the IC. The method includes revising the layout by repositioning a thermally critical pin assignment and a device.