AUTOMATED RESIDUAL MATERIAL DETECTION

Methods, systems, and structures for detecting residual material on semiconductor wafers are provided. A method includes scanning a test structure including topographic features on a surface of a semiconductor wafer. The method further includes determining, based on the scanning, that the test struc...

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Bibliographische Detailangaben
Hauptverfasser: STAMPER ANTHONY K, TOPIC-BEGANOVIC ZELJKA, MALING JEFFREY C
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:Methods, systems, and structures for detecting residual material on semiconductor wafers are provided. A method includes scanning a test structure including topographic features on a surface of a semiconductor wafer. The method further includes determining, based on the scanning, that the test structure includes an amount of a residual material of a sacrificial layer that exceeds a predetermined threshold.