Aqua Regia and Hydrogen Peroxide HCl Combination to Remove Ni and NiPt Residues

Aqua Regia and Hydrogen Peroxide HCl Combination to Remove Ni and NiPt Residues

A method for cleaning residues from a semiconductor substrate during a nickel platinum silicidation process is disclosed, including a multi-step residue cleaning, including exposing the substrate to an aqua regia solution, followed by an exposure to a solution having hydrochloric acid and hydrogen p...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: KARLSSON OLOV, FITZ CLEMENS, DUONG ANH
Format: Patent
Sprache:eng
Schlagworte:
ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES
BASIC ELECTRIC ELEMENTS
CANDLES
CHEMISTRY
DETERGENT COMPOSITIONS
DETERGENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FATTY ACIDS THEREFROM
METALLURGY
RECOVERY OF GLYCEROL
RESIN SOAPS
SEMICONDUCTOR DEVICES
SOAP OR SOAP-MAKING
USE OF SINGLE SUBSTANCES AS DETERGENTS
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Beschreibung
Zusammenfassung:A method for cleaning residues from a semiconductor substrate during a nickel platinum silicidation process is disclosed, including a multi-step residue cleaning, including exposing the substrate to an aqua regia solution, followed by an exposure to a solution having hydrochloric acid and hydrogen peroxide. The SC2 solution can further react with remaining platinum residues, rendering it more soluble in an aqueous solution and thereby dissolving it from the surface of the substrate.