GAS SENSOR PACKAGE

Provided is a gas sensor package, including: a first substrate including a gas inflow hole; and a gas sensing element mounted to the first substrate and including a gas sensing portion disposed to correspond to the gas inflow hole.

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Bibliographische Detailangaben
Hauptverfasser: BAE YUN MI, HWANG GO EUN, PAIK JEE HEUM
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:Provided is a gas sensor package, including: a first substrate including a gas inflow hole; and a gas sensing element mounted to the first substrate and including a gas sensing portion disposed to correspond to the gas inflow hole.