METHOD OF FORMING SEMICONDUCTOR STRUCTURE

A method of forming a semiconductor device is disclosed. A gate structure is formed on a substrate. The gate structure includes a dummy gate and a spacer at a sidewall of the dummy gate. A dielectric layer is formed on the substrate outside of the gate structure. A metal hard mask layer is formed to...

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Bibliographische Detailangaben
Hauptverfasser: CHEN CHIH-HSIEN, LIU YL-LIANG, CHEN YEN-MING, WANG CHUN-HSIUNG, SIE WU-SIAN, HUANG PONG, HUNG I-LUN, KUNG CHANG-HUNG, HSU CHIA-LIN, LI YU-TING
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:A method of forming a semiconductor device is disclosed. A gate structure is formed on a substrate. The gate structure includes a dummy gate and a spacer at a sidewall of the dummy gate. A dielectric layer is formed on the substrate outside of the gate structure. A metal hard mask layer is formed to cover tops of the dielectric layer and the spacer and to expose a surface of the gate structure. The dummy gate is removed to form a gate trench. A low-resistivity metal layer is formed on the metal hard mask layer filling in the gate trench. The low-resistivity metal layer outside of the gate trench is removed. The metal hard mask layer is removed.