SERVER

A server includes a motherboard and a heat dissipation module. The motherboard includes a heat source. The heat dissipation module includes a cooling plate, a liquid cooling heat exchanger, a circulation line and several fans. The cooling plate is thermally contacted with the heat source. The liquid...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LIN MAOING, HUANG KUOIN
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!