SERVER

A server includes a motherboard and a heat dissipation module. The motherboard includes a heat source. The heat dissipation module includes a cooling plate, a liquid cooling heat exchanger, a circulation line and several fans. The cooling plate is thermally contacted with the heat source. The liquid...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	LIN MAOING, HUANG KUOIN
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	A server includes a motherboard and a heat dissipation module. The motherboard includes a heat source. The heat dissipation module includes a cooling plate, a liquid cooling heat exchanger, a circulation line and several fans. The cooling plate is thermally contacted with the heat source. The liquid cooling heat exchanger is located on one side of the motherboard. The liquid cooling heat exchanger is connected with the cooling plate via the circulation line for forming a circulation circuit. The plurality of fans are located next to the liquid cooling heat exchanger.