SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

The present invention provides a semiconductor package and a method of fabricating the same, including: placing a semiconductor element in a groove of a carrier; forming a dielectric layer on the semiconductor element; forming on the dielectric layer a circuit layer electrically connected to the sem...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	CHEN SHIHING, KE CHUNI, TSENG WEN-TSUNG, LAI YI, CHIU SHIH-KUANG, YEH MAO-HUA, LU CHUN-HUNG, CHIU CHI-HSIN, YUAN TSUNG-TE, CHEN HSIEN-WEN, LIN CHUN-TANG, CHEN LU-YI, LU CHANG-LUN, MA GUANG-HWA
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	The present invention provides a semiconductor package and a method of fabricating the same, including: placing a semiconductor element in a groove of a carrier; forming a dielectric layer on the semiconductor element; forming on the dielectric layer a circuit layer electrically connected to the semiconductor element; and removing a first portion of the carrier below the groove to keep a second of the carrier on a sidewall of the groove intact for the second portion to function as a supporting part. The present invention does not require formation of a silicon interposer, therefore the overall cost of the final product is much reduced.