METHOD AND SYSTEM FOR AN IMMERSION BOILING HEAT SINK

METHOD AND SYSTEM FOR AN IMMERSION BOILING HEAT SINK

A method and system for cooling a heat-generating component are provided. The system includes a heat generating electronic component including a heat conductive face, a heat sink device including at least one open face pin fin array surface directly coupled to the conductive face, each fin including...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: BROWNE ERIC AYRES, SUBRAMANYAM ANURAG KASYAP VEJJUPALLE, RUSH BRIAN MAGANN, GUNTURI SATISH SIVARAMA, LAI RIXIN
Format: Patent
Sprache:eng
Schlagworte:
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:A method and system for cooling a heat-generating component are provided. The system includes a heat generating electronic component including a heat conductive face, a heat sink device including at least one open face pin fin array surface directly coupled to the conductive face, each fin including a distal end including an outwardly facing contact area, the contact areas covering only a portion of the conductive face, the contact areas configured to carry electrical current therethrough, and an immersion of dielectric fluid contained in a vessel, the vessel including a heat-conductive hull at least partially submerged in a heat sink fluid.