MULTIPLE LEVEL REDISTRIBUTION LAYER FOR MULTIPLE CHIP INTEGRATION

A package with multiple chips and a shared redistribution layer is described. In one example, a first and a second die are formed where the first and the second die each have a different height. The dies are placed on a substrate. The first, the second, or both dies are ground so that the first and...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	GOETZ EDMUND, MOLZER WOLFGANG, MEMMLER BERND, MAHNKOPF REINHARD
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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