COUPLER, ELECTRONIC COMPONENT, AND MANUFACTURING METHOD FOR ELECTRONIC COMPONENT

A coupler 1A includes an input terminal and an output terminal which are provided on a substrate (substrate K1, planarizing film H0, and insulating film H01), a main line provided on the substrate and having one end connected to the input terminal and the other end connected to the output terminal, and a sub line including a conductive film M1 and a resistive film R1 which are provided on the substrate and electromagnetically coupled to the main line at a part of the conductive film M1. The conductive film M1 has wiring patterns L23 and L25. The resistive film R1 includes a resistive film pattern R13 having an end portion R13a fitted into between the wiring pattern L23 and substrate and an end portion R13b fitted into between the wiring pattern L25 and substrate. The end portions R13a and R13b each contact the conductive film M1 at least at its upper surface and end surface.