ELECTRICALLY DIVISIBLE POLYAMIDE ADHESIVE
A melt adhesive containing 20 to 90 wt % of at least one polyamide having a molecular weight (Mw) from 10,000 to 250,000 g/mol; 1 to 25 wt % of at least one organic or inorganic salt; 0 to 60 wt % of further additives, wherein the adhesive has a softening point from 100° C. to 220° C. Additionally d...
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| creator | KOPANNIA SIEGFRIED MCARDLE CIARAN KOLBE JANA HEUCHER REIMAR STUVE MANUELA |
| description | A melt adhesive containing 20 to 90 wt % of at least one polyamide having a molecular weight (Mw) from 10,000 to 250,000 g/mol; 1 to 25 wt % of at least one organic or inorganic salt; 0 to 60 wt % of further additives, wherein the adhesive has a softening point from 100° C. to 220° C. Additionally described is a process for reversible adhesive bonding of substrates, wherein the adhesive bond is released under tension after application of an electrical voltage. |
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Additionally described is a process for reversible adhesive bonding of substrates, wherein the adhesive bond is released under tension after application of an electrical voltage.</description><language>eng</language><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ; ADHESIVES ; CHEMISTRY ; DYES ; LAYERED PRODUCTS ; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ; PAINTS ; PERFORMING OPERATIONS ; POLISHES ; TRANSPORTING ; USE OF MATERIALS AS ADHESIVES</subject><creationdate>2014</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20141225&DB=EPODOC&CC=US&NR=2014374032A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76294</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20141225&DB=EPODOC&CC=US&NR=2014374032A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KOPANNIA SIEGFRIED</creatorcontrib><creatorcontrib>MCARDLE CIARAN</creatorcontrib><creatorcontrib>KOLBE JANA</creatorcontrib><creatorcontrib>HEUCHER REIMAR</creatorcontrib><creatorcontrib>STUVE MANUELA</creatorcontrib><title>ELECTRICALLY DIVISIBLE POLYAMIDE ADHESIVE</title><description>A melt adhesive containing 20 to 90 wt % of at least one polyamide having a molecular weight (Mw) from 10,000 to 250,000 g/mol; 1 to 25 wt % of at least one organic or inorganic salt; 0 to 60 wt % of further additives, wherein the adhesive has a softening point from 100° C. to 220° C. 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Additionally described is a process for reversible adhesive bonding of substrates, wherein the adhesive bond is released under tension after application of an electrical voltage.</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng |
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| subjects | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS PERFORMING OPERATIONS POLISHES TRANSPORTING USE OF MATERIALS AS ADHESIVES |
| title | ELECTRICALLY DIVISIBLE POLYAMIDE ADHESIVE |
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