ELECTRICALLY DIVISIBLE POLYAMIDE ADHESIVE

A melt adhesive containing 20 to 90 wt % of at least one polyamide having a molecular weight (Mw) from 10,000 to 250,000 g/mol; 1 to 25 wt % of at least one organic or inorganic salt; 0 to 60 wt % of further additives, wherein the adhesive has a softening point from 100° C. to 220° C. Additionally d...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	KOPANNIA SIEGFRIED, MCARDLE CIARAN, KOLBE JANA, HEUCHER REIMAR, STUVE MANUELA
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS PERFORMING OPERATIONS POLISHES TRANSPORTING USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	A melt adhesive containing 20 to 90 wt % of at least one polyamide having a molecular weight (Mw) from 10,000 to 250,000 g/mol; 1 to 25 wt % of at least one organic or inorganic salt; 0 to 60 wt % of further additives, wherein the adhesive has a softening point from 100° C. to 220° C. Additionally described is a process for reversible adhesive bonding of substrates, wherein the adhesive bond is released under tension after application of an electrical voltage.