ELECTRONIC COMPONENT MANUFACTURING APPARATUS AND ELECTRONIC COMPONENT MANUFACTURING METHOD

An electronic component manufacturing method includes the steps of preparing at least one electronic component chip having a first surface and a second surface opposite each other; holding the electronic component chip between a first plate and a second plate such that the first surface is in contac...

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Bibliographische Detailangaben
Hauptverfasser:	MIZUKAMI MIYUKI, OGATA KATSUNORI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CAPACITORS CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Beschreibung
Zusammenfassung:	An electronic component manufacturing method includes the steps of preparing at least one electronic component chip having a first surface and a second surface opposite each other; holding the electronic component chip between a first plate and a second plate such that the first surface is in contact with a first elastic layer of the first plate and the second surface is in contact with a second elastic layer of the second plate; and turning the electronic component chip by relatively moving the first and second plates in a planar direction thereof using a planar movement mechanism and moving the first and second plates in accordance with a turning path of the electronic component chip using the planar movement mechanism and a vertical movement mechanism.