Optical Die Test Interface

An integrated circuit optical die test interface and associated testing method are described for using scribe area optical mirror structures (106) to perform wafer die tests on MEMS optical beam waveguide (112) and optical circuit elements (113) by perpendicularly deflecting optical test signals (12...

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Bibliographische Detailangaben
Hauptverfasser:	MCSHANE MICHAEL B, PELLEY PERRY H, STEPHENS TAB A
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MEASURING MEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES PHYSICS SEMICONDUCTOR DEVICES TESTING TRANSMISSION
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Beschreibung
Zusammenfassung:	An integrated circuit optical die test interface and associated testing method are described for using scribe area optical mirror structures (106) to perform wafer die tests on MEMS optical beam waveguide (112) and optical circuit elements (113) by perpendicularly deflecting optical test signals (122) from the scribe area optical mirror structures (106) into and out of the plane of the integrated circuit die under test (104) and/or production test die (157).