LIGHT SOURCE PACKAGE AND METHOD OF MANUFACTURING THE SAME

LIGHT SOURCE PACKAGE AND METHOD OF MANUFACTURING THE SAME

A package for a light source is disclosed. In particular, a Plastic Leaded Chip Carrier (PLCC) is described which provides enhanced heat dissipating properties. Moreover, the PLCC is described as comprising a single-gage leadframe, which provides for enhanced design flexibility and reduced manufactu...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: LEE CHIAU JIN, ABDUL KARIM NORFIDATHUL AIZAR, TAN KHENG LENG
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A package for a light source is disclosed. In particular, a Plastic Leaded Chip Carrier (PLCC) is described which provides enhanced heat dissipating properties. Moreover, the PLCC is described as comprising a single-gage leadframe, which provides for enhanced design flexibility and reduced manufacturing costs. Methods of manufacturing light source packages are also disclosed.