METHOD AND APPARATUS FOR IC 3D LEAD INSPECTION HAVING COLOR SHADOWING

A system for three-dimensional inspection of leads mounted on an integrated circuit device includes an integrated circuit device, a first light source having a first color, a second light source having a second color different from the first color, a RGB color camera and a processor. The first light...

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Bibliographische Detailangaben
Hauptverfasser:	FRANDSEN, JR. WALTER JAMES, DING KEXIANG KEN
Format:	Patent
Sprache:	eng
Schlagworte:	CALCULATING COMPUTING COUNTING IMAGE DATA PROCESSING OR GENERATION, IN GENERAL INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MEASURING MEASURING ANGLES MEASURING AREAS MEASURING IRREGULARITIES OF SURFACES OR CONTOURS MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS PHYSICS TESTING
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Beschreibung
Zusammenfassung:	A system for three-dimensional inspection of leads mounted on an integrated circuit device includes an integrated circuit device, a first light source having a first color, a second light source having a second color different from the first color, a RGB color camera and a processor. The first light source is disposed at an acute angle to the integrated circuit device, and is configured to illuminate the leads such that lead shadows are created in a first color plane. The second light source is disposed in front of a surface of the integrated circuit device on which the leads are mounted, and is configured to illuminate the leads in a second color plane. The camera is configured to image the illuminated leads and lead shadows. The processor is configured to analyze the first and second color planes of a single image to detect three-dimensional bent leads.