SEMICONDUCTOR TEST METHOD AND SEMICONDUCTOR TEST APPARATUS

A semiconductor test method includes attaching a sheet to a wafer on which a plurality of chips are formed, the sheet having a plurality of holes, each of which corresponds to a position of one of the chips, dicing the wafer to separate the plurality of chips into individual chips while the sheet re...

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Bibliographische Detailangaben
Hauptverfasser:	MORINO KEIJI, MIKI KENICHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MEASURING MEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES PHYSICS SEMICONDUCTOR DEVICES TESTING
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Beschreibung
Zusammenfassung:	A semiconductor test method includes attaching a sheet to a wafer on which a plurality of chips are formed, the sheet having a plurality of holes, each of which corresponds to a position of one of the chips, dicing the wafer to separate the plurality of chips into individual chips while the sheet remains attached to the individual chips, and after the dicing and while the sheet remains attached to the individual chips, measuring the electrical characteristics of the chips.