STRUCTURE AND METHOD FOR MAKING CRACK STOP FOR 3D INTEGRATED CIRCUITS
A structure to prevent propagation of a crack into the active region of a 3D integrated circuit, such as a crack initiated by a flaw at the periphery of a thinned substrate layer or a bonding layer, and methods of forming the same is disclosed.
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | A structure to prevent propagation of a crack into the active region of a 3D integrated circuit, such as a crack initiated by a flaw at the periphery of a thinned substrate layer or a bonding layer, and methods of forming the same is disclosed. |
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