METHOD OF FABRICATING A PACKAGE SUBSTRATE

METHOD OF FABRICATING A PACKAGE SUBSTRATE

A method of fabricating a package substrate includes: preparing a base substrate; forming a metal material layer surrounding an entire surface of the base substrate; forming sacrificial patterns on partial regions of the base substrate on which the metal material layer is formed; forming pads contac...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: LEE JEONG SUK, PARK HYO BIN, EOM JI HYUN, LEE NAM GIL
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS
SEMICONDUCTOR DEVICES
TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
TECHNICAL SUBJECTS COVERED BY FORMER USPC
TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Beschreibung
Zusammenfassung:A method of fabricating a package substrate includes: preparing a base substrate; forming a metal material layer surrounding an entire surface of the base substrate; forming sacrificial patterns on partial regions of the base substrate on which the metal material layer is formed; forming pads contacting lateral surfaces of the sacrificial patterns; forming a gold plating layer on upper surfaces of the pads; and removing the sacrificial patterns and removing portions of the metal material layer to form a conductive layer that remains on partial regions so as to contact lower surfaces of the pads.