BACKING ELEMENT AND ULTRASOUND PROBE INCLUDING SAME

The present disclosure in some embodiment provides a backing member for an ultrasonic probe that is disposed on a rear surface of a piezoelectric element constituting the ultrasonic probe to attenuate ultrasonic waves radiated from the rear surface of the piezoelectric element, the backing member in...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: BAE BYUNGKUK, LEE SUSUNG
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:The present disclosure in some embodiment provides a backing member for an ultrasonic probe that is disposed on a rear surface of a piezoelectric element constituting the ultrasonic probe to attenuate ultrasonic waves radiated from the rear surface of the piezoelectric element, the backing member including a mixture of a base member and a filler, wherein the base member is a polyurethane resin and the filler is manganese powder, whereby the backing member has appropriate sound absorption function and excellent dicing processability and provides an ultrasonic probe including the backing member.