METHOD FOR FABRICATING SEMICONDUCTOR DEVICE

A method for fabricating a semiconductor device includes sequentially forming an etch stop film and an insulating film on a substrate including a lower pattern forming a conductive mask pattern including a first opening on the insulating film, forming a via-hole in the insulating film using the cond...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: JANG WOO-JIN, BOK SEUNG-IL, KIM JONG-SAM, SON SAE-IL, SHIN HONG-JAE, KO DONG-WHAN
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:A method for fabricating a semiconductor device includes sequentially forming an etch stop film and an insulating film on a substrate including a lower pattern forming a conductive mask pattern including a first opening on the insulating film, forming a via-hole in the insulating film using the conductive mask pattern as an etch mask, the via-hole exposing the etch stop film, removing the conductive mask pattern, and forming a passivation film along a side wall of the via-hole after removing the conductive mask pattern.