METHOD OF MANUFACTURING A SEMICONDUCTOR COMPONENT AND STRUCTURE

METHOD OF MANUFACTURING A SEMICONDUCTOR COMPONENT AND STRUCTURE

A semiconductor component and methods for manufacturing the semiconductor component that includes a three dimensional helically shaped common mode choke. In accordance with embodiments, a transient voltage suppression device may be coupled to the monolithically integrated common mode choke.

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Bibliographische Detailangaben
Hauptverfasser: HOLLAND PHILLIP, LIOU DER MIN, MARREIRO DAVID D, LIU RONG, SHASTRI SUDHAMA C, SHARMA UMESH
Format: Patent
Sprache:eng
Schlagworte:
ELECTRICITY
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Beschreibung
Zusammenfassung:A semiconductor component and methods for manufacturing the semiconductor component that includes a three dimensional helically shaped common mode choke. In accordance with embodiments, a transient voltage suppression device may be coupled to the monolithically integrated common mode choke.