FABRICATION METHOD OF SEMICONDUCTOR PACKAGE

FABRICATION METHOD OF SEMICONDUCTOR PACKAGE

A fabrication method of a semiconductor package is provided, which includes the steps of: forming a packaging substrate on a first carrier; bonding a second carrier to the packaging substrate; removing the first carrier; disposing a chip on the packaging substrate; forming an encapsulant on the pack...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: HUNG LIANG YI, LAN CHANG YI, TANG SHAO TZU, SUN MING CHEN, HSIAO WEI CHUNG, TSAI YING CHOU, LIN CHUN HSIEN, PAI YU CHENG
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A fabrication method of a semiconductor package is provided, which includes the steps of: forming a packaging substrate on a first carrier; bonding a second carrier to the packaging substrate; removing the first carrier; disposing a chip on the packaging substrate; forming an encapsulant on the packaging substrate for encapsulating the chip; and removing the second carrier. The first and second carriers provide the thin-type packaging substrate with sufficient rigidity for undergoing the fabrication processes without cracking or warpage, thereby meeting the miniaturization requirement and improving the product yield.