COVER STRUCTURE FOR ELECTRONIC CIRCUIT MODULE

A cover structure for an electronic circuit module includes a circuit board and a box-shaped cover integrated to each other. An electronic component is mounted on the circuit board. The cover has at least one open side. The cover includes a top plate and a mounting leg. The top plate is disposed so...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	ONISHI TADAAKI, SUGIMORI YOSHIO
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	A cover structure for an electronic circuit module includes a circuit board and a box-shaped cover integrated to each other. An electronic component is mounted on the circuit board. The cover has at least one open side. The cover includes a top plate and a mounting leg. The top plate is disposed so as to oppose the circuit board. The mounting leg is joined to the circuit board. The mounting leg is bent and extends from an outer periphery of the top plate. The top plate includes a bend portion and a cutaway portion. The bend portion is connected to the mounting leg. The cutaway portion is provided near the bend portion.