METHODS FOR CONTROLLING ACROSS-WAFER DIRECTED SELF-ASSEMBLY

METHODS FOR CONTROLLING ACROSS-WAFER DIRECTED SELF-ASSEMBLY

A method for treating a layered substrate including a layer of a block copolymer is provided. The method includes identifying a non-uniformity in the layer of the block copolymer; controlling a process variable correlated to the non-uniformity in the layer of the block copolymer; and annealing the l...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: SOMERVELL MARK H
Format: Patent
Sprache:eng
Schlagworte:
AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
PERFORMING OPERATIONS
SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR
SHAPING OR JOINING OF PLASTICS
TRANSPORTING
WORKING OF PLASTICS
WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:A method for treating a layered substrate including a layer of a block copolymer is provided. The method includes identifying a non-uniformity in the layer of the block copolymer; controlling a process variable correlated to the non-uniformity in the layer of the block copolymer; and annealing the layer of the block copolymer under a process condition affected by the process variable to compensate for at least a portion of the non-uniformity in the layer of the block copolymer to form a pattern comprising a plurality of domains having improved uniformity therein. The method further provides a way for reducing a non-uniformity in a layered substrate comprising a layer of a block copolymer on a pre-patterned substrate.