INTEGRATED CIRCUIT PACKAGE

An integrated circuit ("IC") package including an IC assembly mounted on a leadframe and an encapsulant block covering the IC assembly and portions of the leadframe. The encapsulant block has a molded chamfered outer surface portion and the leadframe has a saw cut outer periphery.

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Bibliographische Detailangaben
1. Verfasser:	KEONG LIM JIN
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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Beschreibung
Zusammenfassung:	An integrated circuit ("IC") package including an IC assembly mounted on a leadframe and an encapsulant block covering the IC assembly and portions of the leadframe. The encapsulant block has a molded chamfered outer surface portion and the leadframe has a saw cut outer periphery.