METHOD OF MANUFACTURING A CIRCUIT BOARD

A method of manufacturing a circuit board includes providing a metal substrate and applying a dielectric layer to the metal substrate and sacrificial bumps on the dielectric layer. The method also includes printing a conductive seed layer on the dielectric layer and the sacrificial bumps and plating...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	MYERS MARJORIE KAY, GEIGER JOHN PATTON, MALSTROM CHARLES RANDALL
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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