METHOD OF MANUFACTURING A CIRCUIT BOARD

A method of manufacturing a circuit board includes providing a metal substrate and applying a dielectric layer to the metal substrate and sacrificial bumps on the dielectric layer. The method also includes printing a conductive seed layer on the dielectric layer and the sacrificial bumps and plating...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	MYERS MARJORIE KAY, GEIGER JOHN PATTON, MALSTROM CHARLES RANDALL
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	A method of manufacturing a circuit board includes providing a metal substrate and applying a dielectric layer to the metal substrate and sacrificial bumps on the dielectric layer. The method also includes printing a conductive seed layer on the dielectric layer and the sacrificial bumps and plating a conductive circuit layer onto the conductive seed layer. The method includes removing sections of the conductive seed layer and sections of the conductive circuit layer during a circuit common removal process