SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

A semiconductor package structure includes a chip unit, a package unit and an electrode unit. The chip unit includes at least one semiconductor chip. The semiconductor chip has an upper surface, a lower surface, and a surrounding peripheral surface connected between the upper and the lower surfaces, and the semiconductor chip has a first conductive pad and a second conductive pad disposed on the lower surface thereof. The package unit includes a package body covering the upper surface and the surrounding peripheral surface of the semiconductor chip. The package body has a first lateral portion and a second lateral portion respectively formed on two opposite lateral sides thereof. The electrode unit includes a first electrode structure covering the first lateral portion and a second electrode structure covering the second lateral portion. The first and the second electrode structures respectively electrically contact the first and the second conductive pads.