THERMAL CONTROL OF DEVICE USING FLUID COOLANT

Assemblies, methods, and systems for controlling the temperature of an electronic device are described. One method includes positioning an electronic device in a chamber and electrically coupling a probe to the electronic device. The method also includes flowing a fluid in contact with the electronic device at a flow rate, the fluid comprising a liquid. A current is applied to the probe to carry out an electronic device testing operation, and a temperature of the electronic device is monitored during the electronic testing operation. The method may also include determining whether a change to the flow rate or temperature is necessary based on the monitored temperature of the electronic device. In one aspect of certain embodiments, the electronic device may be positioned so that each of the sides of the electronic device may be at least partially in contact with the fluid during the electronic device testing operation.