SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF

The semiconductor device includes a SiC substrate; an aluminum nitride layer provided on the substrate and having an island-shaped pattern consisting of plural islands: a channel layer provided on the AlN layer and comprising a nitride semiconductor; an electron supplying layer provided on the chann...

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Bibliographische Detailangaben
Hauptverfasser: NAKATA KEN, ICHIKAWA HIROYUKI, KOUCHI TSUYOSHI, YUI KEIICHI, MAKABE ISAO
Format: Patent
Sprache:eng
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Zusammenfassung:The semiconductor device includes a SiC substrate; an aluminum nitride layer provided on the substrate and having an island-shaped pattern consisting of plural islands: a channel layer provided on the AlN layer and comprising a nitride semiconductor; an electron supplying layer provided on the channel layer and having a band gap larger than that of the channel layer; and a gate, source and drain electrodes on the electron supply layer. The AlN layer has an area-averaged circularity Y/X of greater than 0.2. Y is a sum of values obtained by multiplying circularities of the plural islands by areas of the plural islands respectively, X is a sum of the areas of the plural islands. The circularity are calculated by a formula of (4 ×area)/(length of periphery)2 where the area and the length of periphery are an area and a length of periphery of each island.