COMPOSITIONS AND METHODS OF MAKING THIN WALL HOUSINGS FOR ELECTRONIC DEVICES

Provided herein are high flow and ductile thermoplastic resin compositions for the formation of thin wall articles and articles with desirable impact strengths. These compositions are useful in the manufacture of various shaped, formed and/or molded articles.

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Bibliographische Detailangaben
Hauptverfasser: MALINOSKI JON MICHAEL, EVANS THOMAS L
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:Provided herein are high flow and ductile thermoplastic resin compositions for the formation of thin wall articles and articles with desirable impact strengths. These compositions are useful in the manufacture of various shaped, formed and/or molded articles.